Target supply unit of extreme ultraviolet light source apparatus and method of manufacturing the same

ABSTRACT

In a target supply unit of an extreme ultraviolet light source apparatus for generating extreme ultraviolet light by applying a laser beam to a target material to turn the target material into plasma, clogging of a target nozzle for supplying the target material to a laser beam application point is suppressed. The target supply unit includes: a target container for accommodating the target material; a target nozzle for injecting the target material supplied from the target container; and a reducing gas supply unit for supplying a reducing gas into the target container. Instead of using the reducing gas, a carbon-based material having a reduction action may be provided within the target container for causing reduction reaction.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from Japanese Patent ApplicationNo. 2008-269050 filed on Oct. 17, 2008, the contents of which areincorporated herein by reference in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a target supply unit to be used forsupplying a target in an extreme ultraviolet (EUV) light sourceapparatus and a method of manufacturing the target supply unit.

2. Description of A Related Art

In recent years, as semiconductor processes become finer,photolithography has been making rapid progress toward finerfabrication. In the next generation, microfabrication at 60 nm to 45 nm,further, microfabrication at 32 nm and beyond will be required.Accordingly, in order to fulfill the requirement for microfabrication at32 nm and beyond, for example, exposure equipment is expected to bedeveloped by combining an EUV light source for generating EUV lighthaving a wavelength of about 13 nm and reduced projection reflectiveoptics.

As the EUV light source, there is an LPP (laser produced plasma) typeEUV light source using plasma generated by applying a laser beam to atarget. The LPP type EUV light source has advantages that extremely highintensity close to black body radiation can be obtained because plasmadensity can be considerably made higher, that light of only theparticular waveband can be radiated by selecting the target material,and that an extremely large collection solid angle can be ensuredbecause it is a point source having a substantially isotropic angledistribution and there is no structure such as electrodes surroundingthe light source. Therefore, the LPP type EUV light source ispredominant as a light source for photolithography.

In the LPP type EUV light source apparatus, the EUV light, which isemitted from plasma generated by applying a laser beam to a targetmaterial of tin or the like within a vacuum chamber, is reflected by anEUV collector mirror provided within the vacuum chamber and emitted tothe outside. When debris generated from the target material adheres tothe EUV collector mirror, the reflectivity of the EUV collector mirrorfor EUV light having a wavelength of 13.5 nm becomes lower, and as aresult, EUV light output emitted to the outside becomes lower. On thisaccount, it is necessary to reduce the debris generated from the targetmaterial.

As a related technology, Japanese Patent Application PublicationJP-P2008-98081A discloses a method of adjusting energy of a laser beamto suppress generation of debris. Further, there is known a method ofsuppressing debris by supplying the minimum amount of target necessaryfor obtaining desired EUV energy. According to this method, typically,the target is formed in minute spherical shapes having diameters ofseveral micrometers to several tens of micrometers. In order to obtainthe shapes, a molten metal is injected from a microscopic injection holehaving a diameter of several tens of micrometers formed in a targetnozzle into vacuum. However, since the injection hole is extremelynarrow, there has been a problem that oxides contained in the moltenmetal, impurities transferred from a target container or contained inthe molten metal, a metal solidified due to temperature nonuniformity,or the like clogs the injection hole, and injection of the molten metalbecomes impossible. Particularly, the most common cause of the injectionhole clogging is oxides adhered to a metal surface before melting orcontained in the metal, or oxides adhered to an inner wall of the targetcontainer.

The applicant have searched, but not found any prior art documents thatpoint out problems about clogging in the target injection hole of thetarget supply unit or disclose their technical solutions.

SUMMARY OF THE INVENTION

The present invention has been achieved in view of the above-mentionedproblems. A purpose of the present invention is, in a target supply unitof an extreme ultraviolet light source apparatus for generating extremeultraviolet light by applying a laser beam to a target material to turnthe target material into plasma, to suppress clogging of a target nozzlefor supplying the target material to a laser beam application point.

In order to accomplish the above-mentioned purpose, a target supply unitaccording to a first aspect of the present invention is a target supplyunit to be used in an extreme ultraviolet light source apparatus forgenerating extreme ultraviolet light by applying a laser beam to atarget material to turn the target material into plasma, and the targetsupply unit includes: a target container for accommodating the targetmaterial; a target nozzle for injecting the target material suppliedfrom the target container; and a reducing gas supply unit for supplyinga reducing gas into the target container.

Further, a target supply unit according to a second aspect of thepresent invention is a target supply unit to be used in an extremeultraviolet light source apparatus for generating extreme ultravioletlight by applying a laser beam to a target material to turn the targetmaterial into plasma, and the target supply unit includes: a targetcontainer including a carbon-based material having a reduction action,for accommodating the target material; and a target nozzle for injectingthe target material supplied from the target container.

Furthermore, a method of manufacturing a target supply unit according toa third aspect of the present invention is a method of manufacturing atarget supply unit to be used in an extreme ultraviolet light sourceapparatus for generating extreme ultraviolet light by applying a laserbeam to a target material to turn the target material into plasma, andthe method includes the steps of: (a) accommodating the target materialwithin a target container connected to a target nozzle; (b) reducing anoxide contained in the target material accommodated within the targetcontainer; and (c) sealing the target container.

According to the present invention, the oxide contained in the targetmaterial is reduced and dissolved by the reducing gas or thecarbon-based material having a reduction action, and thereby, cloggingof the target nozzle can be suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a basic diagram of a target supply unit according to the firstembodiment of the present invention;

FIG. 2 is a diagram showing a configuration of the target supply unitaccording to the first example of the present invention;

FIG. 3 is a flowchart showing a reduction operation of the target supplyunit according to the first example of the present invention;

FIG. 4 is a diagram showing a configuration of a target supply unitaccording to the second example of the present invention;

FIG. 5 is a diagram showing a configuration of a target supply unitaccording to the third example of the present invention;

FIG. 6 is a diagram showing a partial configuration of a target supplyunit according to the fourth example of the present invention;

FIG. 7 is a diagram showing a configuration of a target supply unitaccording to the second embodiment of the present invention;

FIG. 8 is a flowchart showing a reduction operation of the target supplyunit according to the second embodiment of the present invention;

FIG. 9 is a diagram showing a partial configuration of a target supplyunit according to the fifth example of the present invention;

FIG. 10 is a flowchart showing a method of manufacturing a target supplyunit according to one embodiment of the present invention; and

FIG. 11 is a diagram showing a configuration of an extreme ultravioletlight source apparatus including the target supply unit according to oneembodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, preferred embodiments of the present invention will beexplained in detail by referring to the drawings. The same referencenumerals are assigned to the same component elements and the explanationthereof will be omitted.

First Embodiment

FIG. 1 is a basic diagram of a target supply unit according to the firstembodiment of the present invention. The target supply unit as shown inFIG. 1 is provided in an upper part of a vacuum chamber, in which atarget is turned into plasma, and supplies the target to a focusingpoint of a laser beam focused at high density. The target supply unitincludes a target container 10 filled with a target material 1 such astin (Sn), lithium (Li), or the like, and a target nozzle 13 formed witha target path as a microscopic injection hole having a diameter ofseveral tens of micrometers. The target container 10 is connected to areducing gas cylinder 11 via a pipe.

The reducing gas cylinder 11 is filled with a reducing gas such ashydrogen gas (H₂) or carbon monoxide gas (CO) having strong reducingpower, for example. In the case where the hydrogen gas is used as thereducing gas, it is preferable to use a material that is hard to causehydrogen brittleness, for example, SUS 316 or the like as a material ofthe target container 10.

In the route of the pipes connecting the target container 10 to thereducing gas cylinder 11, a mass flow controller MFC1 and changeovervalves 24 and 27 are provided. By operating or controlling these, supplyof the reducing gas to the target container 10, sealing and evacuationof the target container 10, and so on are performed. Here, the reducinggas cylinder 11, the mass flow controller MFC1, and the changeover valve24 form a reducing gas supply unit for supplying the reducing gas intothe target container 10.

According to the above-mentioned configuration, the reducing gas can beintroduced into the target container 10 to perform reduction reaction ofoxides contained in the target material 1. By reducing the oxidescontained in the target material 1, an oxide of the reducing gas, forexample, water or water vapor (H₂O), or carbon dioxide gas (CO₂) isproduced. When the reduction reaction is almost completed, the supply ofthe reducing gas is stopped.

Through the procedure, in the case where tin is used as the targetmaterial 1, the tin oxide adhered to the tin target within the targetcontainer 10 is reduced and changed to a tin metal. In this manner, bydecreasing the oxide contained in the target material 1, the amount ofthe solid material in the molten metal becomes smaller when the metal asthe target material 1 is melted, and clogging of the target nozzle 13becomes hard to occur.

As below, the respective examples of the present invention will beexplained.

FIRST EXAMPLE

FIG. 2 is a diagram showing a configuration of the target supply unitaccording to the first example of the present invention. In the targetsupply unit according to the example, the target container 10 isconnected to the reducing gas cylinder 11, a pressurization gas cylinder12, a vacuum pump 14, and a gas analysis unit 21 via pipes.

Further, to the target container 10, a heater 15, a temperature sensor22, and a pressure sensor 23 are attached. The heater 15 is for heatingand melting the target material 1, and heating the reducing gas toadjust a reaction temperature. To the pipe of the reducing gas, also aheater 16 for heating the reducing gas to adjust a reaction temperatureis attached.

In the route of the pipe connecting the target container 10 to thereducing gas cylinder 11, the pressurization gas cylinder 12, the vacuumpump 14, and the gas analysis unit 21, mass flow controllers MFC1, MFC2,MFC3, and changeover valves 24-28 are provided. Here, the pressurizationgas cylinder 12, the mass flow controller MFC2, and the changeover valve25 form a pressurization gas supply unit for supplying a pressurizationgas into the target container 10. The pressurization gas is used foradjusting the pressure within the target container 10 and diluting thereducing gas. The mass flow controllers MFC1, MFC2, MFC3 and thechangeover valves 24-28 execute supply of gases to the target container10, sealing and evacuation of the target container 10, and so on underthe sequence control of a control unit 20.

FIG. 3 is a flowchart showing a reduction operation of the target supplyunit according to the first example of the present invention. The highera temperature of the reducing gas becomes, the more the reductionreaction of the oxides contained in the target material 1 is promoted.Therefore, the control unit 20 controls the heaters 15 and 16 to raisetemperatures of the target container 10 and the reducing gas pipe to adesired temperature and adjust the temperatures of them (step S11).

Then, the control unit 20 controls the changeover valves 24-28 to startthe supply of the reducing gas, and controls the mass flow controllersMFC1 and MFC2 to supply the reducing gas at desired concentration intothe target container 10, and thereby, causes the reduction reaction ofthe target material 1 (step S12). The reducing gas concentration can beadjusted according to the set value of the mass flow controller MFC1provided near the reducing gas cylinder 11 and the set value of the massflow controller MFC2 provided in a location where the pressurization gasis added to the reducing gas. Here, the optimal reducing gasconcentration may be determined by experiments or the like in advance,or automatically determined according to a measurement result of the gasanalysis unit. The dilution of the reducing gas may be performed byusing the pressurization gas as shown in FIG. 2, or by using anappropriate diluting gas separately. Alternatively, a reducing gashaving concentration appropriately adjusted in advance may be used.

Further, the control unit 20 controls the mass flow controller MFC3provided in an exhaust pipe to adjust the pressure within the targetcontainer 10 (step S13). The gas passing through the mass flowcontroller MFC3 is exhausted to the atmosphere via the vacuum pump 14.In the case where the reducing gas is hydrogen gas (H₂), the hydrogengas is diluted or burnt and released into the atmosphere because thehydrogen gas has explosiveness. On the other hand, in the case where thereducing gas is carbon monoxide gas (CO), the carbon monoxide gas isdetoxified and released into the atmosphere because the carbon monoxidegas has toxicity. The target nozzle 13, which is provided to the targetcontainer 10 and formed with a target path as a microscopic injectionhole, is opened to the vacuum chamber. Accordingly, the gas within thetarget container 10 flows out into the vacuum chamber, and therefore, itis preferable that the gas within the vacuum chamber is also evacuatedby the vacuum pump, treated in the same manner as that described above,and released into the atmosphere.

By reducing the oxides contained in the target material 1 by using thereducing gas, a reaction product (oxide) of the reducing gas, forexample, water or water vapor (H₂O), or carbon dioxide gas (CO₂) isproduced. In the case where the target material 1 is tin (Sn), it isrecommended that the reaction temperature is set slightly lower than themelting temperature of tin, that is, 232° C. The oxide of the targetmaterial 1 is formed on the surface of the target material 1, and thus,in order that the reducing gas acts on the oxides of the target material1, it is preferable that tin does not melt, but holds its solid shape.

The reducing gas deprives the oxide of the target material 1 of oxygenby the reduction reaction, and becomes a reaction product (an oxide ofthe reducing gas) such as water (H₂O) or carbon dioxide gas (CO₂). Thegas analysis unit 21 provided in the route of the exhaust pipe monitorsconcentration of the reaction product to output a monitor signalrepresenting the concentration of the reaction product As the gasanalysis unit 21, a dew-point meter, a Fourier transform infraredspectrophotometer (FT-IR), or the like can be used. The control unit 20monitors the concentration of the reaction product in the exhaust gasbased on the monitor signal outputted from the gas analysis unit 21(step S14), and determines whether or not the concentration of thereaction product is equal to or less than the predeterminedconcentration (step S15).

When the concentration of the reaction product is more than thepredetermined concentration, the process returns to step S12. At thetime when the concentration of the reaction product becomes equal to orless than predetermined concentration, the control unit 20 determinesthat the reduction treatment is almost completed. Alternatively, in thecase where the time required for the reduction treatment is knownbeforehand, the reduction treatment may be controlled by the flow timeof the reducing gas. When it is determined that the reduction treatmentis almost completed, the control unit 20 controls the changeover valve24 or 26 to stop the supply of the reducing gas (step S16).

Since the reducing gas left in the target container 10 or the pipe mayhave an adverse effect on the target production, it is preferable thatthe control unit 20 performs several times of purges by using thepressurization gas within the pressurization gas cylinder 12 andexhausts the reducing gas from the target container 10 (step S17).

Through the above-mentioned operation, the tin oxide within the targetcontainer 10 is reduced to become tin metal. In this manner, an amountof the oxide of the target material 1 is decreased, and thereby, anamount of the solid material within the molten metal becomes smallerwhen the metal as the target material 1 is melted, and the accidents aredecreased in which the target nozzle is clogged.

In the above-mentioned operation, supply and exhaust of the reducing gasare performed at the same time. However, supply and exhaust of thereducing gas may be alternately performed. Further, in theabove-mentioned operation, the reduction reaction of the oxides isperformed while the target material 1 within the target container 10remains in the solid state. However, the temperature of the targetmaterial 1 may be raised to a temperature higher than the melting pointthereof by the heater 15, and the oxides may be reduced while the targetmaterial 1 is in the liquid phase state. When the oxides are reducedwhile the target material 1 is in the solid state, the reaction speedbecomes high because the surface area is larger. On the other hand, whenthe oxides are reduced while the target material 1 is in the liquidstate, the reaction speed becomes high because the reaction temperatureis higher. It is preferable that a selection is made among the statesdepending on conditions such as a gas contact area according to shapesof the target material and the target container and so on, and thereby,the reduction reaction is performed at the higher reaction speed. Whenthe oxides are reduced while the target material 1 is in the liquidstate, the liquid-state target material 1 flows out from the injectionhole of the target nozzle 13 according to the differential pressurebetween the target container 10 and the vacuum chamber. Therefore, it isdesirable that the pressure within the vacuum chamber is slightly raisedby using an inert gas or the like so that the target material 1 does notflow out at the reduction stage.

When the target material 1 is supplied into the vacuum chamber, thecontrol unit 20 controls the heater 15 to raise the temperature of thetarget container 10 to a predetermined temperature and melt the targetmaterial 1. Further, the control unit 20 controls the pressurization gassupply unit to introduce the pressurization gas into the targetcontainer 10, and thereby, the molten target material is injected fromthe injection hole formed in the target nozzle 13 into the vacuumchamber.

SECOND EXAMPLE

FIG. 4 is a diagram showing a configuration of a target supply unitaccording to the second example of the present invention. Since thenormal-state hydrogen gas (H₂) has weaker reducing power than theradical-state hydrogen (hydrogen radical), the reduction reaction speedcan be made higher by using the hydrogen radical having the strongerreducing power. Accordingly, in the target supply unit according to theexample, the reducing gas is radicalized before being supplied to thetarget container 10, and thereby, the efficiency of the reductionreaction is made higher. For the purpose, a radicalizing unit 17 forradicalizing the reducing gas is provided in the route of the reducinggas supply pipe. The rest of the configuration is the same as that ofthe first example.

The radicalizing unit 17 includes a microwave plasma unit, or ahigh-temperature heating unit using a filament formed of a materialhaving a high melting point such as tungsten, or the like, and canradicalize the reducing gas while the reducing gas passes therethrough.The radicalizing unit 17 is disposed in a location as close as possibleto the target container 10 so that a sufficient amount of the reducinggas reaches the target material 1 before the radicalized reducing gasbecomes inactivated.

The target supply unit according to the example efficiently reduces theoxides contained in the target material 1 or the oxides separated fromthe target container 10 and mixed in the target material 1 back to metalcomponents, and thus, the oxide components clogging the injection holeof the target nozzle 13 are decreased and the frequency of the cloggingaccidents becomes lower.

THIRD EXAMPLE

FIG. 5 is a diagram showing a configuration of a target supply unitaccording to the third example of the present invention. The thirdexample is characterized in that a reducing agent, which is in a liquidstate at room temperature, is gasified to be the reducing gas, andincludes a gasifying unit 18 in place of the reducing gas cylinder 11.in the first example. The gasifying unit 18 gasifies the reducing agentby heating or bubbling, and an acid solution containing formic acid,acetic acid, hydrochloric acid, or the like may be used as the reducingagent.

FOURTH EXAMPLE

FIG. 6 is a diagram showing a partial configuration of a target supplyunit according to the fourth example of the present invention. In thefourth example, a pressure container 30 is provided in addition to areaction container (target container) 36, and a gate valve 32 isprovided between the reaction container 36 and the pressure container 30to connect them. The rest of the configuration is the same as those inthe first to third examples.

In the fourth example, the reduction treatment of the target material 1is performed within the reaction container 36 separated from thepressure container 30 requiring pressurization. When the gate valve 32is opened after the reduction treatment of the target material 1 isfinished, the target material 1 moves from the reaction container 36 tothe pressure container 30 through a target transfer path connecting thereaction container 36 and the pressure container 30. Then, the targetmaterial 1 is melted by a heater 31 attached to the pressure container30, and the interior of the pressure container 30 is pressurized, andthereby, the droplet target is supplied into the vacuum chamber throughan injection hole of a target nozzle 33.

When the target material 1 is moved from the reaction container 36 tothe pressure container 30, it is desirable that the interior of thepressure container 30 is sufficiently evacuated by using the vacuum pump14 and the evacuation pipe. In the case where the interior of thereaction container 36 is pressurized by opening the gate valve 32 whenthe target is supplied from the pressure container 30 into the vacuumchamber, the pressure resistance of the gate valve 32 is not necessaryto be excessive, but the same pressure resistance as that of thepressure container 30 is required for the reaction container 36. On theother hand, in the case where the pressurizing pipe and the evacuationpipe are provided to the pressure container 30, and the target issupplied by closing the gate valve 32 and pressurizing the interior ofthe pressure container 30 by the pressurization gas supply unit, thepressure resistance is required for the gate valve 32, but the highpressure resistance is not required for the reaction container 36.

According to the example, since the reaction container 36 and thepressure container 30 are separated, the target material is suppliedfrom the pressure container 30 into the vacuum chamber while thereduction treatment of the subsequent target material is performedwithin the reaction container 36 at the same time, and thereby, thedowntime in the supply of the target material can be shortened.

Second Embodiment

FIG. 7 is a diagram showing a configuration of a target supply unitaccording to the second embodiment of the present invention. The targetsupply unit according to the embodiment is characterized in thatreduction treatment of oxides contained in the target material isperformed by using a carbon-based material having a reduction action(reduction function) prepared within the target container instead ofsupplying the reducing gas from the outside into the target container.

The target supply unit according to the embodiment supplies a target toa laser beam focusing point within a vacuum chamber 34 in which thetarget is turned into plasma. The target supply unit includes a targetcontainer 10 filled with a target material 1 such as tin (Sn), lithium(Li), or the like, and a target nozzle 13 formed with a target path asan injection hole having a diameter of several tens of micrometers. Thetarget container 10 is connected to a pressurization gas cylinder 12, avacuum pump 14, and a gas analysis unit 21 via pipes. Further, to thetarget container 10, a heater 15, a temperature sensor 22, and apressure sensor 23 are attached. The heater 15 is for heating andmelting the target material 1, and adjusting a reaction temperature.Furthermore, a vacuum gauge 35 is provided to the vacuum chamber 34.

A carbon-based material 19 having a reduction action is disposed withinthe target container 10. The target material 1 filling the interior ofthe target container 10 is heated by the heater 15, melted at a hightemperature, and comes into contact with the carbon-based material 19.Thereby, the oxides contained in the target material 1 are reduced, andcarbon dioxide gas (CO₂) is produced. As the carbon-based material 19having a reduction action, graphite or a composite containing carbon isused. The composite containing carbon includes carbon composite fiberscalled C/C composite, for example. The C/C composite is a material inwhich graphite is reinforced with carbon fibers, and has light weight,high strength, high elasticity, and high heat-resistance.

The target supply unit according to the embodiment may not necessarilyemploy a reducing gas cylinder. In the route of the pipes connecting thetarget container 10 to the pressurization gas cylinder 12, the vacuumpump 14, and the gas analysis unit 21, mass flow controllers MFC2 andMFC3, and changeover valves 25, 27, 28 are provided. Here, thepressurization gas cylinder 12, the mass flow controller MFC2, and thechangeover valve 25 form a pressurization gas supply unit for supplyinga pressurization gas into the target container 10. The pressurizationgas is used for adjusting the pressure within the target container 10.The mass flow controllers MFC2 and MFC3 and the changeover valves 25,27, 28 execute supply of gases to the target container 10, sealing andevacuation of the target container 10, adjustment of the internalpressure of the vacuum chamber 34, or the like under the sequencecontrol of a control unit 20.

FIG. 8 is a flowchart showing a reduction operation of the target supplyunit according to the second embodiment of the present invention. Thecontrol unit 20 controls the heater 15 to raise the temperature of thetarget container 10 to a predetermined temperature and melt the targetmaterial 1 (step S21). Here, the higher the reaction temperaturebecomes, the more the reaction is promoted, and thus, it is preferablethat the temperature is raised to an appropriate temperature.

When the temperature of the target material 1 reaches the temperature atwhich reduction reaction occurs, the oxides contained in the targetmaterial 1 react with the carbon-based material 19 within the targetcontainer 10, and carbon dioxide gas (CO₂) is produced. Then, thecontrol unit 20 controls the vacuum pump 14 to evacuate the interior ofthe target container 10, and thereby, the carbon dioxide is exhaustedinto the atmosphere (step S22).

Alternatively, the carbon dioxide may be exhausted by purging the targetcontainer 10 by using an inertia gas or the like stored within thepressurization gas cylinder 12. When the interior of the targetcontainer 10 is pressurized by an inertia gas or the like, the pressurewithin the target container 10 rises, and the control unit 20 controlsthe mass flow controllers MFC2 and MFC3 to adjust the pressure withinthe target container 10. Further, the control unit 20 adjusts thepressure within the vacuum chamber 34 so that the molten target materialmay not be injected from the target nozzle 13. In order to adjust theinternal pressure of the vacuum chamber 34, an appropriate amount ofinertia gas may be introduced from the pressurization gas cylinder 12into the vacuum chamber 34 via a pipe and a mass flow controller.Alternatively, a pressure adjustment gas may be used.

By reducing the oxides contained in the target material 1, carbondioxide gas (CO₂) is produced. The gas analysis unit 21 such as an FT-IRprovided in the route of the exhaust pipe monitors the concentration ofthe carbon dioxide gas and outputs a monitor signal representing theconcentration of the carbon dioxide gas. The control unit 20 monitorsthe concentration of the carbon dioxide gas in the exhaust gas based onthe monitor signal outputted from the gas analysis unit 21 (step S23),and determines whether or not the concentration of the carbon dioxidegas is equal to or less than predetermined concentration (step S24).

When the concentration of the carbon dioxide gas is more than thepredetermined concentration, the process returns to step S22. At thetime when the concentration of the carbon dioxide gas becomes equal toor less than predetermined concentration, the control unit 20 determinesthat the reduction treatment is almost completed. Alternatively, thetime required for the reduction treatment is known beforehand, thereduction treatment may be controlled by the flow time of the exhaustgas. When the reduction treatment is determined to be almost completed,the control unit 20 lowers the temperature of the target container 10 tostop the reduction reaction (step S25).

The control unit 20 prevents accidental reaction by evacuating theinterior of the target container 10 or filling the target container 10with an inertia gas (step S26).

Through the above-mentioned operation, when tin is used as the targetmaterial 1, a tin oxide within the target container 10 is reduced tobecome tin metal. In this manner, the oxides of the target material 1are decreased, and thereby, the amount of the solid material within themolten metal is reduced when the metal as the target material 1 ismelted, and the accidents are decreased in which the target nozzle isclogged.

When the target material 1 is supplied into the vacuum chamber, thecontrol unit 20 controls the heater 15 to raise the temperature of thetarget container 10 to the predetermined temperature and melt the targetmaterial 1. Further, the control unit 20 controls the pressurization gassupply unit to introduce the pressurization gas into the targetcontainer 10, and thereby, the molten target material is injected fromthe injection hole formed in the target nozzle 13 into the vacuumchamber 34.

FIFTH EXAMPLE

FIG. 9 is a diagram showing a partial configuration of a target supplyunit according to the fifth example of the present invention. In thefifth example, the target container 10 in the second embodiment isseparated into a reaction container (target container) 36 and a pressurecontainer 30 as in the fourth example, and a gate valve 32 is providedbetween the reaction container 36 and the pressure container 30 toconnect them. The rest of the configuration is the same as that in thesecond embodiment. In the fifth example, in order to smoothly performthe reduction reaction of the target material 1 such as tin or the likewith a carbon-based material having a reduction reaction, the reactiontakes place under the condition at a high temperature. Therefore, thepressure-resistance of the reaction container 36 may be lowered due tothe high temperature. On this account, it is reasonable to separate thereaction container 36 requiring high-temperature treatment and thepressure container 30 requiring pressurization for dropping the moltentin.

Accordingly, in the example, reduction reaction at a high temperaturetakes place within the reaction container 36 separated from the pressurecontainer 30 requiring pressurization. After the reduction reaction isfinished, the temperature of the target material is adjusted at arelatively low temperature and the gate valve 32 is opened, and then,the target material 1 moves to the pressure container 30. Then, a heater31 attached to the pressure container 30 adjusts the temperature of thetarget material, and the pressurization gas supply unit pressurizes theinterior of the pressure container 30, and thereby, the droplet targetis supplied into the vacuum chamber through the injection hole of atarget nozzle 33.

According to the example, since the reaction container 36 requiring ahigh-temperature environment and the pressure container 30 requiring ahigh-pressure environment are separated from each other, the respectiverequired specifications are relaxed. Further, pressure resistance is notrequired for the reaction container 36, and the material of thecontainer can be the carbon-based material.

Manufacturing Method

FIG. 10 is a flowchart showing a method of manufacturing a target supplyunit according to one embodiment of the present invention.

In the first to fourth examples as shown in FIGS. 2-6, the target supplyunits including the reducing gas cylinder 11 or gasifying unit 18 havebeen explained. In the case where the target supply unit is provided inan EUV light source apparatus, at the maintenance or the like of the EUVlight source apparatus, a reducing gas can be introduced into the targetsupply unit to reduce oxides of a target material.

On the other hand, in FIG. 10, a method of manufacturing the targetsupply unit including neither reducing gas cylinder 11 nor gasifyingunit 18 will be explained.

First, an operator accommodates a target material within a targetcontainer connected to a target nozzle with an injection hole sealed(step S31). For example, as shown in FIG. 1, a target material 1 isaccommodated within the target container 10 connected to the reducinggas cylinder 11. Alternatively, as shown in FIG. 7, the target material1 is accommodated within the target container in which the carbon-basedmaterial 19 is disposed.

Then, the operator reduces the oxides contained in the target materialaccommodated within the target container (step S32). For example, thestep is executed by introducing the reducing gas from the reducing gascylinder 11 into the target container 10 via the pipe in FIG. 1. Here,according to need, the reduction reaction may be promoted by heating thetarget container or the like. Alternatively, the step is executed byraising the temperature of the target container 10 to the predeterminedtemperature and melting the target material 1 in FIG. 7.

Through the step, the reduction reaction of the oxides of the targetmaterial occurs within the target container, and an oxide of thereducing gas or carbon is produced, and accordingly, the operatorexhausts the gas produced within the target container by using theexhaust pipe connected to the target container. In this regard,according to need, the concentration of the oxide in the exhaust gas maybe measured by a gas analysis unit provided to the exhaust pipe, and thereduction reaction may be finished when the concentration of the oxidein the exhaust gas is equal to or less than predetermined concentration.Further, after the concentration of the oxide becomes equal to or lessthan a fixed value, the interior of the target container may beevacuated by a vacuum pump, or a purge gas may be introduced into thetarget container by using a pressurization gas cylinder.

Then, the operator closely seals the target container (step S33). Forexample, in FIG. 2, the changeover valves 24-28 are closed, and thetarget container 10 together with the changeover valves 27 and 28 isseparated from the mass flow controllers MFC2 and MFC3, the vacuum pump14, the gas analysis unit 21, and so on, and then, the target supplyunit is completed.

The above-mentioned steps are performed within a manufacturing plant ofthe target supply unit, and the target supply unit is mounted to the EUVlight source apparatus in a location where the EUV light sourceapparatus is installed, and then, the target supply unit can be used inwhich the amount of oxides contained in the target material within thetarget container is smaller and the target nozzle is hard to be clogged.

EUV Light Source Apparatus

FIG. 11 is a diagram showing a configuration of an extreme ultravioletlight source apparatus including the target supply unit according to oneembodiment of the present invention. The EUV light source apparatusemploys a laser produced plasma (LPP) type for generating EUV light byapplying a laser beam to a target material for excitation.

As shown in FIG. 11, the EUV light source apparatus includes a vacuumchamber 2, a target supply unit, a target collecting unit 8, a driverlaser 3, and a laser beam focusing optics 9, and an EUV collector mirror5.

The vacuum chamber 2 is a chamber in which EUV light is generated. Inthe vacuum chamber 2, a window 7 for passing a laser beam generated bythe driver laser 3 into the vacuum chamber 2, and an exposure unitconnection port 6 for outputting the EUV light generated within thevacuum chamber 2 to an exterior exposure unit are provided.

The target supply unit includes a target container 10, a target nozzle13, a reducing gas cylinder 11, a mass flow controller MFC1, andchangeover valves 24 and 27. A target material such as tin (Sn), lithium(Li), or the like is stored within the target container 10. Further, amicroscopic injection hole for injecting the target material is formedin the target nozzle 13.

Within the target container 10, oxides contained in the target materialare reduced by a reducing gas supplied from the reducing gas cylinder 11via the changeover valve 24, the mass flow controller MFC1, and thechangeover valve 27. The target material after reduction treatment isheated and melted within the target container 10 by a heater (notshown), and injected as droplets from the injection hole formed in thetarget nozzle 13. Among the droplets that have been supplied into thevacuum chamber 2, unnecessary droplets not irradiated with a laser beamare collected by the target collecting unit 8.

The drive laser 3 is a laser beam source for generating a pulsed laserbeam having a high repetition rate. The laser beam focusing optics 9includes at least one lens and/or at least one mirror. The laser beamgenerated by the driver laser 3 is focused on a droplet within thevacuum chamber 2 via the laser beam focusing optics 9 and the window 7so as to form a focal point on the droplet. The droplet target materialis excited by the energy of the laser beam to generate plasma, andvarious wavelength components including EUV light are radiatedtherefrom.

The EUV collector mirror 5 is a spheroidal mirror having a spheroidalconcave reflection surface formed with a molybdenum (Mo)/silicon (Si)multilayer coating for selectively reflecting a particular wavelengthcomponent, for example, EUV light having a wavelength near 13.5 nm fromamong various wavelength components radiated from plasma. The EUVcollector mirror 5 is disposed such that the first focal position of thespheroid is located at a plasma emission point, and the EUV light isfocused on the second focal position of the spheroid, i.e., anintermediate focusing point and then outputted to the external exposureunit.

The exposure unit includes optics for illuminating a mask and optics forprojecting an image of the mask on a work piece, and exposes the maskpattern on the work piece to light by using the EUV light.

Although the mass flow controller is used for controlling the flow rateof the reducing gas, the pressurization gas, or the exhaust gas in theexamples as shown in FIGS. 1, 2, 4, 5, 7 and 11, the present inventionis not limited to these examples, but a unit suitable for supplying orevacuating a gas may be used in the apparatus according to the presentinvention.

Further, although a spherical solid is used as the target material inthe examples as shown in FIGS. 1, 2, 4, 5, 7 and 11, the presentinvention is not limited to these examples, but the target material maybe a metal ingot, or a liquid metal overheated and melted in advance. Inthese cases, reduction to a certain degree of oxides of the targetmaterial can be performed.

1-12. (canceled)
 13. A method of manufacturing a target supply unit tobe used in an extreme ultraviolet light source apparatus for generatingextreme ultraviolet light by applying a laser beam to a target materialto turn the target material into plasma, said method comprising thesteps of: (a) accommodating the target material within a targetcontainer connected to a target nozzle; (b) reducing an oxide containedin the target material accommodated within said target container; and(c) sealing said target container.
 14. The method according to claim 13,wherein step (a) includes accommodating the target material within atarget container including a carbon-based material having a reductionaction.
 15. The method according to claim 13, wherein step (b) includesintroducing a reducing gas within said target container.
 16. The methodaccording to claim 13, wherein step (b) includes exhausting a gas withinsaid target container.
 17. The method according to claim 15, whereinsaid reducing gas contains at least one of hydrogen gas, hydrogenradical, and carbon monoxide gas.